Staff Process Engineer - Electroplating and CMP
Core
Manufacturing engineer owner of wet processes (Electroplating and CMP) in magnetic recording head wafer fabrication, responsible for statistical process control, optimization, and failure analysis.
Role type
Staff Process Engineer (Wet Processes)
Builds
Magnetic recording head wafers for storage systems
Domain
Semiconductor manufacturing / Magnetic recording
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical process control (SPC), electroplating tool operation, CMP tool operation, failure analysis, process optimization, cleanroom operations, JMP proficiency, data analytics
Preferred skills
Ph.D., AI-driven data analytics, smart manufacturing systems
Technologies
JMP, electroplating tools, CMP tools
Responsibilities
Conduct failure analysis for process/tool deviations, optimize process performance for uniform deposition/removal, introduce and qualify new wet process equipment, maintain process margin and chemistries
Seniority
Staff, hands-on IC