Chief Packaging Engineer - 906
Core
Define and execute the architecture for advanced packaging of next-generation ion traps and related components, balancing technical leadership with hands-on contribution.
Role type
Chief Packaging Engineer (IC with strategic leadership)
Builds
Advanced packaging solutions for ion trap chips with complex optical, electrical, and mechanical interfaces
Domain
Quantum computing hardware / Semiconductor packaging / Photonics
Deliverable
production ML models | product features
Required skills
Advanced semiconductor packaging development, Microelectronic packaging, Photonic packaging, Mechanical/thermal/electrical interface design, Vendor partnership management, Cross-functional team leadership, Large-format chip packaging strategies, Heterogeneous integration, High-density I/O technologies, IP development
Preferred skills
PhD in Physics or Engineering, Large area multi-chip packaging, Fiber-to-chip coupling, 2.5-3D packaging techniques
Technologies
Ion trap components, Optical interfaces, Electrical interfaces, Mechanical interfaces
Responsibilities
Define advanced packaging architecture for ion traps, Lead cross-functional teams on packaging strategies, Oversee short loops for packaging performance validation, Work with vendors to implement and validate processes, Provide technical guidance to packaging engineers, Champion engagements with 3rd parties for partnerships
Seniority
Executive/Chief level, strategic leadership with deep technical contribution
