High Speed Digital and Photonics Applications Engineer
Core
Regional technical expert for High-Speed Digital, Optical Communications, Silicon Photonics, and AI Datacenter physical-layer technologies, serving as the primary interface for strategic customers from evaluation through production ramp.
Role type
Senior IC applications engineer (optical communications & silicon photonics)
Builds
Advanced validation and characterization solutions for optical transceivers, silicon photonics devices, Co-Packaged Optics, high-speed SerDes, AI accelerator interconnects, and memory interfaces.
Domain
Semiconductor / Optical Communications / Datacenter Infrastructure
Required skills
Optical transceiver technologies (400G, 800G, 1.6T), Silicon Photonics, Co-Packaged Optics (CPO), High-speed SerDes, PCIe Gen5/6/7, Ethernet, InfiniBand, DDR5/6/HBM/CXL, Signal Integrity, Power Integrity, Jitter Analysis, Eye-Diagram Analysis, BER Validation, Compliance Testing, Real-Time Oscilloscopes, Sampling Oscilloscopes, Digital Communication Analyzers (DCA), Bit Error Ratio Testers (BERT), Vector Network Analyzers (VNA), Optical Spectrum Analyzers, Lightwave Component Analyzers, Protocol Analyzers, Logic Analyzers, IEEE/OIF/PCI-SIG/JEDEC standards knowledge.
Preferred skills
Customer executive engagement, Architectural planning, Solution lifecycle management, Automation software development, Data analytics capabilities, Reusable application methodology creation, Technical demonstration design.
Technologies
QSFP-DD, OSFP, OSFP-XD, PCIe, Ethernet, InfiniBand, DDR, HBM, CXL, IEEE, OIF, PCI-SIG, JEDEC
Responsibilities
Serve as regional technical expert for physical-layer technologies; Act as primary technical interface for strategic customers; Engage with customer executives, architects, and R&D leaders; Architect and deploy advanced validation solutions; Design and optimize measurement methodologies; Create reusable application methodologies and technical demonstrations.
Seniority
Senior, hands-on IC
