Principal/Staff Engineer, PCVD Film Deposition, TD
Core
Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for next-generation memory technologies and device architectures.
Role type
Principal/Staff IC process engineer (semiconductor manufacturing)
Builds
Advanced memory devices (DRAM, NAND, NOR) and storage products
Domain
Semiconductor manufacturing / Thin film deposition
Deliverable
production ML models
Required skills
ALD, LPCVD, PECVD, PVD process development, DOE design and execution, root-cause analysis, film growth mechanisms, surface chemistry, plasma physics, thermodynamics, chemical kinetics, reaction engineering, statistical analysis (SPC), TCAD/simulation, data analytics, machine learning, thin film metrology (TEM, SEM, XPS, SIMS, XRD, AFM, ellipsometry), predictive modeling
Preferred skills
Technology roadmap definition, strategic research leadership, IP generation, mentoring, cross-functional collaboration
Technologies
ALD, LPCVD, PECVD, PVD, TCAD, SPC, TEM, SEM, XPS, SIMS, XRD, AFM, ellipsometry
Responsibilities
Develop and optimize thin film deposition processes; Design and execute complex DOE experiments; Perform root-cause analysis using modeling and characterization; Collaborate with integration, metrology, and equipment teams; Drive innovation in film deposition for performance and cost efficiency; Utilize data analytics and ML to predict process behavior; Define technology roadmaps and lead strategic research; Mentor junior engineers
Seniority
Principal/Staff, hands-on IC with strategic leadership