Senior Staff Engineer Encapsulation
Core
Process owner and expert driving innovation, pre-development, and development of Molding processes for silicon wafers in a cleanroom environment.
Role type
Senior Staff Engineer, Manufacturing Process Development
Builds
Robust Molding processes for semiconductor power systems and IoT products
Domain
Semiconductor manufacturing / IC Packaging
Required skills
Molding process development, IC Packaging concepts, Process/Equipment engineering, Statistical tools (JMP, CEDA), Analytical and problem-solving skills (P/DFMEA, DMAIC, 8D), Design of Experiment (DoE), Analytical and metrological tools (SAT, Smart Scope, Hisomet), Molding process assembly
Preferred skills
Experience in IC Packaging Concept and Process/Equipment Engineering
Technologies
JMP, CEDA, Smart Scope, Hisomet
Responsibilities
Drive innovation, pre-development, and development of Molding processes; Ensure timely development of robust Molding processes meeting yield and cost targets; Develop unit processes compliant with Process Development Handbook; Advocate Design for Manufacturing and Design for Cost; Solve complex problems independently; Lead definition and guide process, equipment, and material strategies; Support end-to-end project activities for smooth ramp up.
Seniority
Senior Staff, hands-on IC