Engineer / Senior Engineer Reliability (Advanced Packaging Technologies / Surface Mount Technology)
Core
Develop and execute reliability assessment strategies for new semiconductor package technologies, identifying risks and supporting qualification activities to meet customer and industry requirements.
Role type
Reliability Engineer (Advanced Packaging)
Builds
Reliable semiconductor packages for AI applications and power systems
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Reliability assessment, Failure Mode and Effects Analysis (FMEA), Statistical analysis, Physical failure analysis, Python programming, Data visualization
Preferred skills
Advanced packaging technologies, Surface Mount Technology (SMT), Chip embedding, Tableau
Technologies
Python, Tableau
Responsibilities
Define reliability assessment plans using failure mechanism-based approaches, Execute reliability stress tests and physical analyses, Identify new failure modes and assess potential risks, Support qualification of new packages and production changes, Generate work-instructions for physical failure analysis, Evaluate and qualify chip embedding packages and high-density power modules
Seniority
Junior to Mid-level, hands-on IC
