External Manufacturing Engineer
Core
Drive continuous improvement in package quality, manufacturing processes, operational efficiency, and system robustness at external subcontractors for ON Semiconductor.
Role type
Senior Manufacturing Engineer (Semiconductor Packaging & Assembly)
Builds
Semiconductor packaging and assembly processes for automotive-grade products
Domain
Semiconductor manufacturing, Automotive
Required skills
Semiconductor assembly process knowledge, Root cause analysis (8D, 3-5 Why), Change control management, Risk assessment, Quality audit facilitation, Yield enhancement, Process line drift reduction, Material verification (MRB), Leadership in troubleshooting
Preferred skills
VDA certification, IATF16949 certification, Power IC experience
Technologies
Wire bond base (Ag, Au, Cu, Al), 8D, Is-Is Not, SQIN, EFAR
Responsibilities
Lead task force initiatives for process and quality improvements, Ensure process robustness and risk mitigation across subcontractor operations, Manage change control processes and risk assessments, Investigate EFAR and SQIN issues and implement corrective actions, Deploy and scale Best Known Methods (BKMs) across sites, Facilitate and support customer and subcontractor audits, Manage daily subcontractor operations with onsite presence, Lead operational improvement projects for quality, process, delivery, and cost optimization, Provide production support including maverick material verification and disposition, Execute qualification activities for change management projects
Seniority
Senior, hands-on IC
