Senior Project Manager OSAT
Core
Lead package/process development projects for next generation power modules, PCB embedding, and panel level packaging in the semiconductor industry, ensuring robust technical maturity and seamless transition into serial production.
Role type
Senior IC Project Manager (Advanced Packaging)
Builds
Next generation power modules, PCB embedding, and panel level packaging platforms
Domain
Semiconductor industry, Advanced Packaging, Power Systems
Required skills
Advanced packaging technologies, PCB manufacturing, Chip embedding, Power module packaging, Change management, Cross-functional team leadership, Subcontractor management, Quality requirements knowledge
Preferred skills
PhD in relevant discipline, IPMA-C certification, PCB manufacturing knowledge, Power module packaging knowledge, Subcontractor experience, Multicultural team leadership
Technologies
Advanced packaging technologies, PCB manufacturing, Chip embedding, Power module packaging
Responsibilities
Lead package innovation projects from definition to high volume integration, Enable and release new subcontractors and technology platforms, Manage change projects for package/process/subcon, Lead international and multidisciplinary teams, Support package platform assessments and second source introduction, Align subcontractor/technology roadmap
Seniority
Senior, hands-on IC
