Internship - Software Developer with AI/ML Focus for Chip-Package-Board CoDesign (f/m/div)
Core
Develop and maintain software for semiconductor design processes, integrating AI/ML to automate Electronic Design Automation (EDA) workflows and improve Chip-Package-Board CoDesign methodologies.
Role type
Software Developer Intern (AI/ML focus)
Builds
Software tools and utilities for EDA simulation, design validation, and testing within the Chip-Package-Board CoDesign environment.
Domain
Semiconductor industry / Electronic Design Automation (EDA)
Deliverable
production ML models
Required skills
Python, Java, Perl, AI/ML frameworks, Cadence SKILL, Git, Agile methodologies
Preferred skills
Knowledge of EDA trends, problem-solving abilities
Technologies
Python, Java, Cadence SKILL, Git, Jira
Responsibilities
Design, implement, test, and maintain software supporting semiconductor design processes; Apply AI/ML algorithms to automate EDA workflows; Build solutions in Python, Java, and Cadence SKILL; Examine workflow data to identify optimization opportunities; Create utilities embedding AI/ML optimizations for simulation and validation; Participate in code reviews and define test plans.
Seniority
Intern
