Assembly Process Engineering Manager (PLP)
Core
Lead the development, optimization, and sustaining of Front-Of-Line assembly processes (Pre-Assembly, Die Attach, Wire Bond) to ensure process stability, product quality, and yield enhancement in a high-volume semiconductor environment.
Role type
Senior IC Assembly Process Engineering Manager
Builds
Semiconductor assembly processes and products
Domain
Semiconductor manufacturing / Electronics
Required skills
Process control, Team leadership, DOE, FMEA, SPC, DMAIC, 8D, Structured troubleshooting, Continuous improvement, Technical support for critical quality issues, Knowledge transfer from NPI to production
Preferred skills
None stated
Technologies
Pre-Assembly, Die Attach, Wire Bond
Responsibilities
Lead the FOL team in driving process improvement initiatives and operational excellence; Sustain and improve process performance in terms of quality, yield, and lot hold rate; Support production to achieve WWS targets and improve machine performance and reliability; Coach and develop new engineers; Prepare, review, and maintain process specifications, SOPs, FMEAs, and process control plans; Provide technical support for critical quality issues related to materials and processes; Ensure process compliance and stability within SPC control limits; Facilitate knowledge transfer from NPI to production for new products and technologies.
Seniority
Senior, hands-on IC with leadership
