Assistant Process Engineer (Implant)
Core
Manage cost-effective manufacturing processes in wafer fabrication, ensuring high quality and yield through real-time problem analysis and solution implementation.
Role type
junior IC process engineer (semiconductor manufacturing)
Builds
semiconductor chips
Domain
semiconductor manufacturing
Required skills
wafer fabrication process management, real-time problem analysis, quality control (SPC, FDC), equipment troubleshooting, recipe alignment, process fine-tuning, OCAP procedures, data reporting, operator training support
Preferred skills
electronics/technical background, leadership, coaching
Technologies
MADCS, SPC, FDC, OCAP, Microsoft Office
Responsibilities
Manage manufacturing process procedures and operational issues, maintain day-to-day manufacturing activities, ensure smooth process flow with high quality and yield, manage quality tasks and KPIs, execute SWR/DOE/Trial R&D lots, troubleshoot OOC/OOS events, perform process fine-tuning, support operator training, conduct real-time equipment failure analysis, respond to lots on hold
Seniority
Junior, 1-2 years experience