CareerPlan

Principal Engineer, Region E, Operations Central Teams Advanced Development Team

Hiroshima, JapanFull-time2026-06-29 → 2026-10-23

Core

Own and sustain semiconductor manufacturing integration and processes within the fab to improve yield, quality, and cycle time.

Role type

Principal Engineer, Semiconductor Manufacturing Operations

Builds

High-volume semiconductor manufacturing processes and equipment integration

Domain

Semiconductor manufacturing (Fab)

Required skills

Root cause analysis, Statistical process control (SPC), Failure mode and effects analysis (FMEA), 8D problem solving, Process parameter definition, Defect analysis, Cross-functional collaboration, Yield improvement

Preferred skills

Advanced semiconductor process knowledge (Region E), Process optimization, Data interpretation, Technical leadership

Technologies

SPC, FDC, APC, Manufacturing equipment

Responsibilities

Troubleshoot manufacturing issues using structured methodologies, Analyze process data to identify trends and gaps, Define and adjust process parameters across equipment, Partner with cross-functional teams to resolve process excursions, Support qualification and integration of new equipment and materials, Drive initiatives for yield improvement and cost reduction, Perform defect analysis and long-term investigations

Seniority

Principal, hands-on IC