Senior Engineer, Technical Program Management - Advanced Packaging
Core
Lead end-to-end product lifecycle and change management activities, ensuring supply continuity and mitigating component obsolescence risks across the semiconductor capital equipment portfolio.
Role type
Senior Technical Program Manager (Product Lifecycle & Obsolescence)
Builds
Semiconductor capital equipment and advanced packaging solutions
Domain
Semiconductor manufacturing equipment / Advanced packaging
Required skills
Component obsolescence management, Engineering change processes (ECR/ECO/ECN), Cross-functional program leadership, Supply chain risk mitigation, Manufacturing cut-in planning, PLM data governance, Stakeholder alignment, Executive communication
Preferred skills
Semiconductor equipment industry experience, Customer-facing qualification processes, PLM/ERP systems (Agile, Windchill, Teamcenter, SAP, Oracle), Advanced packaging technologies, Multi-sourcing strategies
Technologies
Agile, Windchill, Teamcenter, SAP, Oracle
Responsibilities
Own end-to-end component and technology obsolescence management from risk identification to closure; Lead operating cadence for obsolescence and change management including governance forums; Partner with Supply Chain, Engineering, and suppliers to monitor lifecycle events (EOL, PCN, PDN) and drive mitigation; Develop and manage obsolescence project plans with scope, schedule, and risk management; Drive alternate part qualification and form-fit-function replacement strategies; Coordinate internal qualification activities including design updates and reliability assessments; Lead customer-facing change management and qualification activities; Plan and execute manufacturing cut-ins and product transitions; Ensure accuracy and integrity of PLM data; Develop last-time-buy recommendations; Identify and communicate risks to protect business continuity; Maintain compliance and audit readiness for change control.
Seniority
Senior, hands-on IC
