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Tech Lead PCB Layout Engineer

Shanghai💼 Full-time🗓 2026-09-18 → 2026-09-25

Core

Designing complex, high-density PCB layouts for rack-scale AI infrastructure connectivity products.

Role type

Tech Lead PCB Layout Engineer

Builds

Custom connectivity solutions for hyperscalers and AI/ML applications

Domain

Semiconductor hardware, AI infrastructure, high-speed interconnect

Deliverable

production ML models | product features

Required skills

High-speed differential pair design, RF design, high-power design, high-density interconnect (HDI) design, signal integrity analysis, power integrity analysis, DFT implementation, DFM implementation, full PCB design lifecycle management, cross-functional system design, independent problem solving, PCB/PCBA engineering qualification handling

Preferred skills

Customer oversight, fluent English communication

Technologies

Cadence Allegro, Polar SI9000, CAM350, AutoCAD

Responsibilities

Design complicated PCB layouts across high-speed interfaces, power, and high-density interconnect fields; execute full PCB design process from feasibility study to DFM and Gerber release; solve signal integrity, power integrity, DFT, and DFM problems independently; collaborate with electrical design community on system development; handle PCB/PCBA engineering qualification (EQ)

Seniority

Senior, hands-on IC with leadership responsibilities

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