Intern - HIG HBM DTPCO
Core
Intern analyzing semiconductor product and manufacturing data to understand device performance and chip-package interactions.
Role type
Intern, data analysis & silicon learning
Builds
Data-driven solutions for engineering workflows in High Bandwidth Memory (HBM) development
Domain
Semiconductor / Memory & Storage / HBM
Deliverable
dashboards & analysis
Required skills
Data analysis, Statistical methods, Data visualization, Root-cause analysis, Programming (Python, MATLAB, SQL, JMP), Cross-functional data correlation
Preferred skills
Semiconductor device knowledge, AI/Generative AI/Agentic AI application, Automation of engineering workflows
Technologies
Python, JMP/JSL, SQL, MATLAB
Responsibilities
Analyze probe, parametric, characterization, electrical, process, and manufacturing data to assess device health. Support engineering experiments and silicon learning through data collection and tracking. Perform cross-functional data correlation to evaluate interactions among design, process, assembly, and electrical performance. Develop automated data-analysis and visualization workflows. Apply AI and Generative AI to improve engineering analysis and problem-solving efficiency.
