New College Grad - HBM Design Architect
Core
Perform first-principles architecture analysis and circuit/CAD simulations for HBM/DRAM products to inform technology options for AI accelerators and data centers.
Role type
Junior IC HBM Design Architect
Builds
Memory solutions for AI accelerators, high-performance computing, and data centers
Domain
Semiconductor / Memory / Advanced Packaging
Required skills
CMOS circuit design, device physics, DRAM fundamentals, power delivery analysis, thermal concepts, circuit simulation (SPICE/HSPICE), CAD environments (Virtuoso), scripting (Python/Tcl/Perl)
Preferred skills
DRAM/HBM design experience, 3D stacking/TSV integration, advanced packaging, PDN/power analysis tools, thermal simulation (FEA/CFD), semiconductor process technology, AI-enabled engineering tools
Technologies
SPICE, HSPICE, FineSim, PrimeSim, Spectre, Cadence Virtuoso, Python, Tcl, Perl, LLMs, Code Assist
Responsibilities
Perform architecture-level analysis for power, PDN, thermal, timing, and area trade-offs; Build first-principles models and correlate with simulation/silicon data; Set up and run circuit simulations and CAD flows; Assess impact of new technologies on product metrics; Partner with designers and technologists to develop architectural solutions; Develop automation scripts and calculators
Seniority
Junior, entry-level IC
