Intern - Package Development Engineering
Core
Intern role focused on semiconductor package development, process improvement, and engineering analytics using AI and automation.
Role type
Intern, IC engineering analyst (semiconductor packaging)
Builds
Engineering dashboards, automation tools, and analytical models for package development
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | dashboards & analysis
Required skills
Analytical problem solving, Engineering data analysis, Semiconductor process knowledge, Yield improvement, Cross-functional collaboration
Preferred skills
Python, Power BI, Excel, AI/ML fundamentals
Technologies
Python, Power BI, Excel
Responsibilities
Collect and analyze engineering data to identify trends and improvement opportunities, Conduct experiments and package/process characterization, Develop dashboards and automation tools to improve productivity, Present project findings and recommendations to leadership