CareerPlan

Principal Firmware Developer, HBM

Folsom, California, United States of AmericaFull-time$181k–$308k2026-10-23 → 2026-11-10

Core

Architect and implement firmware for next-generation Custom High Bandwidth Memory (HBM) products, enabling low-level programming and system control for large-scale AI datacenter environments.

Role type

Principal Firmware Developer (HBM Architecture)

Builds

Next-generation HBM products, driver layers, verification firmware, and manufacturing/test firmware for SoC designs.

Domain

Semiconductor / Memory Technologies / AI Datacenter

Deliverable

production ML models

Required skills

Embedded systems architecture, Low-level firmware development, FPGA prototyping, Silicon bring-up and debug, RAS/diagnostics firmware, High-speed interface protocols (PHY/SoC), DRAM/HBM/JEDEC standards, AI-assisted development workflows

Preferred skills

GPU/TPU firmware experience, Multi-functional silicon team collaboration, AI/ML workload understanding

Technologies

FPGA, SoC, HBM, DRAM, JEDEC, GenAI

Responsibilities

Analyze firmware architecture and requirements to create implementation plans; Deliver firmware solutions for next-generation SoC designs; Leverage FPGA prototyping to develop and validate firmware; Collaborate with architecture and verification teams to co-optimize firmware and hardware; Provide technical leadership from concept through silicon bring-up and product sustainment; Drive innovation into future memory generations using AI workflows.

Seniority

Principal, hands-on IC with strategic leadership