PDE HBM NPI Assembly Engineer
Core
Identify, diagnose, and resolve assembly process problems for new product introduction (NPI) of memory and storage solutions.
Role type
NPI Assembly Engineer
Builds
New process baselines, tools, and materials for memory and storage products
Domain
Semiconductor manufacturing (DRAM, NAND, NOR)
Required skills
Process troubleshooting, equipment/material evaluation, yield improvement, cost reduction, supplier management, audit support, SPC/FDC/RMS/APC support, site-to-site portability
Preferred skills
None stated
Technologies
SPC, FDC, RMS, APC
Responsibilities
Identify, diagnose, and resolve assembly process related problems; Coordinate and execute process, equipment, and material evaluation/optimization initiatives; Lead/participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baseline qualified items; Support SPC/FDC/RMS/APC; Support site to site portability; Manage/audit material suppliers; Support internal and external audits
Seniority
Not stated