CareerPlan

FE OCT CPEE Dry Etch DMTS

Boise, Idaho, United States of AmericaFull-time2026-10-27 → 2026-11-10

Core

Define technical strategy and drive manufacturing innovation for dry etch processes across Micron's global DRAM and NAND manufacturing network.

Role type

Distinguished Member of Technical Staff (DMTS), strategy-level IC

Builds

Scalable dry etch solutions for high-volume manufacturing

Domain

Semiconductor manufacturing (DRAM/NAND)

Required skills

dry etch processes, plasma physics and chemistry, profile control, selectivity, critical dimension control, process integration, statistical process control, data-driven problem solving, manufacturing performance improvement

Preferred skills

advanced dry etch technologies, EUV-enabled integration, advanced analytics, machine learning, AI-enabled solutions, equipment supplier roadmap influence

Technologies

plasma etch, RF systems, gas delivery, electrostatic chuck, AI, machine learning

Responsibilities

Define global technical strategy for dry etch processes; identify performance gaps and lead yield/defectivity improvement initiatives; partner with cross-functional teams to scale new process solutions; influence equipment roadmaps with suppliers; lead high-impact technical programs from concept to implementation; develop governance frameworks for consistent performance; mentor senior engineers and technical leaders.

Seniority

Distinguished Member of Technical Staff (DMTS), strategy & mentorship