Dry Etch Principal Process Development Engineer
Core
Advance and improve plasma dry etch processes for the forthcoming generation of Micron's memory parts, guiding ideas from conception through process development to integration in production facilities.
Role type
Principal Process Development Engineer (Dry Etch)
Builds
Advanced DRAM structures and memory parts
Domain
Semiconductor manufacturing / Memory and storage
Required skills
Plasma etch fundamentals, reactor operation, experimental design, data analysis, root cause and failure mode analysis, process transfer, AI-enabled analysis tools, programming solutions
Preferred skills
Advanced DRAM or 3D device structures experience, vendor relationship management, cross-functional team leadership, yield improvement, SPC
Technologies
Plasma reactors, AI-enabled analysis tools, data-driven methodologies
Responsibilities
Develop and refine dry etch processes for advanced DRAM structures; Collaborate with process integration and other process development teams to develop innovative new solutions; Perform root cause and failure mode analysis on process and hardware limitations; Design experiments and analyze data to improve capability and yield; Support process transfer from development to manufacturing; Apply AI-enabled analysis tools, data-driven methodologies, or programming solutions to improve engineering efficiency and accelerate technical decision-making.
Seniority
Principal, hands-on IC with strategic roadmap influence