SHIFT ENGINEER LEAD, NAND TD RDA and Metrology
Core
Lead shift operations and process development support for NAND TD (Technology Development) RDA and Metrology, ensuring safety, quality, and yield in wafer fabrication.
Role type
Senior IC Shift Engineer Lead (Semiconductor Manufacturing)
Builds
Wafer fabrication processes and tools for early node development part types, test vehicles, and short loop travelers.
Domain
Semiconductor manufacturing (NAND memory)
Required skills
Wafer fabrication industry experience, SPC/process control, yield/defect mechanism analysis, process flow interaction, automation systems proficiency, team leadership, data-driven problem solving
Preferred skills
Passion for automation/AI Agent adoption, experience with Recipe Management and Manufacturing Execution systems
Technologies
SPC, Recipe Management, Manufacturing Execution systems, deviation requests
Responsibilities
Serve as 1st and 2nd line of defense for shift critical area issues (lot hold, disposition, excursions, line-downs, tool downs); Lead shift team to provide process development support including RAM Cycle Time goal achievement and SWR execution; Provide technical expertise and solving complex process and equipment issues; Drive continuous improvement in shift team performance and manage direct reports; Collaborate with process development engineering, equipment development engineering, and suppliers to maintain process/tool performance.
Seniority
Senior, hands-on IC with team leadership