Senior Engineer, PD Adv CMP
Core
Develop and optimize Chemical Mechanical Planarization (CMP) processes for next-generation 3D NAND memory parts to improve product quality, reliability, and yield.
Role type
Senior IC Process Development Engineer (CMP)
Builds
Advanced 3D NAND memory nodes and manufacturing processes
Domain
Semiconductor manufacturing / 3D NAND / Materials Science
Required skills
CMP process development, 300mm wafer fabrication, dielectrics/metals CMP, optical metrology, profilometry, polishing slurries, conditioners, polishing pads, vendor collaboration, process margin improvement, manufacturability evaluation, AI tool integration
Preferred skills
Memory processing planar and vertical NAND flow knowledge, Data science, modelling, AI optimization
Technologies
AMAT (LKP), EBARA-300X, 300mm wafer fabrication tools
Responsibilities
Develop and optimize CMP processes for next-gen memory parts; Perform fundamental research and hardware evaluation for novel applications; Initiate and manage experiments to widen process margins; Collaborate with vendors to meet integration requirements; Design and implement advanced process monitoring and control methodologies; Provide strategic roadmap for future NAND nodes; Mentor new hires on CMP fundamentals and Micron systems; Lead complex, multi-disciplinary projects in quality and yield improvement meetings.
Seniority
Senior, hands-on IC with mentorship responsibilities