Staff Engineer - CMP Advanced NAND
Core
Develop and optimize Chemical Mechanical Planarization (CMP) procedures for next-generation 3D NAND memory parts to improve product quality, reliability, and yield.
Role type
Staff Engineer, CMP Process Development (Semiconductor Manufacturing)
Builds
3D NAND memory parts and storage solutions
Domain
Semiconductor manufacturing, 3D NAND, Chemical Mechanical Planarization (CMP)
Required skills
CMP process development, 300mm wafer fabrication, CMP equipment operation (AMAT, EBARA), optical metrology, profilometry, polishing slurries/conditioners/pads, dielectrics/metals CMP, process integration, vendor collaboration, AI tool integration
Preferred skills
Memory processing planar/vertical NAND flow knowledge, Data science, AI modeling for workflow optimization
Technologies
AMAT (LKP), EBARA-300X, 300mm wafer fabrication tools
Responsibilities
Develop and optimize CMP procedures for next-gen NAND; Manage experiments to widen process margins and evaluate manufacturability; Collaborate with vendors on integration requirements; Design advanced process monitoring and control methodologies; Provide strategic roadmap for future NAND nodes; Mentor new hires on CMP fundamentals; Lead multi-disciplinary projects for quality, yield, and cost improvement.
Seniority
Staff, hands-on IC with strategic roadmap ownership