HBM EQUIPMENT ENGINEER
Core
Evaluate, improve, and optimize assembly manufacturing processes, materials, and equipment for HBM production, utilizing AI for performance analysis. (via careerplan.io/jobs/44769568-hbm-equipment-engineer-at-micron)
Role type
Senior IC equipment engineer (semiconductor manufacturing)
Builds
High-bandwidth memory (HBM) manufacturing processes and equipment capabilities
Domain
Semiconductor manufacturing / Hardware engineering
Deliverable
production ML models
Required skills
Semiconductor equipment operation and maintenance, DOE/FMEA/OCAP/8D/SPC techniques, wafer level molding/dicing/thinning/mount/debond, FDC/Tool alarm analysis, equipment component design, vendor coordination, technical research
Preferred skills
Tool signal understanding (SVID, CEID, ECID), AI application for equipment performance analysis
Technologies
SVID, CEID, ECID, AI tools
Responsibilities
Evaluate and improve assigned assembly manufacturing processes, materials, and equipment; Optimize equipment variables and identify variables for capacity/cost improvement; Perform containment/prevention actions of process and equipment deviations; Design equipment components to improve capability; Coordinate with vendors for equipment upgrades, repairs, and technical support; Conduct regular equipment performance analysis and propose improvements using AI; Prepare and update equipment operation manuals, maintenance logs, and incident reports.
Seniority
Mid-level, hands-on IC