MTB ASSEMBLY PROCESS ENGINEER
Core
Establish, monitor, and optimize daily assembly process parameters for semiconductor manufacturing to ensure stable production lines and drive yield enhancement. (via careerplan.io/jobs/44769524-mtb-assembly-process-engineer-at-micron)
Role type
Junior IC process engineer (semiconductor assembly)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Packaging
Deliverable
production ML models
Required skills
Statistical Process Control (SPC), Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), Root-cause analysis, JMP/Minitab, Semiconductor packaging processes (Wafer Mount, Wafer Singulation, Laser Groove), Failure analysis tools (OM, SEM, EDX, SAT)
Preferred skills
AI-assisted tools integration, Digital fluency
Responsibilities
Monitor and optimize daily assembly process parameters, Lead containment and root-cause analysis of manufacturing defects, Implement SPC to reduce process variation, Author and update SOPs and technical reports, Collaborate with cross-functional teams to resolve technical bottlenecks