CareerPlan

HBM PROCESS ENGINEER

Taichung City, Taichung City, TaiwanFull-time2026-10-05 → 2026-11-11

Core

Leverage AI and advanced analytics to identify process variation, deploy anomaly detection models, and optimize HBM manufacturing processes for stability and yield.

Role type

Senior IC HBM Process Engineer (AI/ML focus)

Builds

HBM memory and storage solutions

Domain

Semiconductor manufacturing (HBM assembly/backend)

Deliverable

production ML models

Required skills

AI/ML model development, anomaly detection, predictive modeling, digital twin creation, data mining, root cause analysis, process optimization, experiment design, knowledge management

Preferred skills

Semiconductor assembly/backend process experience, Lamination, Lapping/Grinding, Laser Dicing

Technologies

Copilot, Power BI, AI Agents, digital twins, large-scale manufacturing data platforms

Responsibilities

Develop and deploy AI-assisted monitoring and predictive models; automate engineering analysis and reporting workflows; partner with Automation, IT, and Data Science teams; establish digital twins and predictive maintenance models; lead AI adoption initiatives to improve productivity and efficiency.

Seniority

Mid-level (2 years exp), hands-on IC