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Intern - HBM Design Development Technical Leadership (DDTL)

Richardson, Texas, United States of America💼 Internship🗓 2026-09-28 → 2026-10-07

Core

Support planning, execution, and coordination of next-generation HBM product development programs by tracking project status, managing risks, and improving engineering productivity.

Role type

Intern, Technical Program Management / Engineering Leadership Support

Builds

Next-generation High Bandwidth Memory (HBM) products for AI, HPC, graphics, and data center applications

Domain

Semiconductor / Memory Technology / Hardware Development

Required skills

Project tracking, risk analysis, data analytics, automation tool development, Python/C++/Tcl/Perl scripting, cross-functional collaboration, AI/LLM tool usage

Preferred skills

Memory technology knowledge (HBM, DRAM, DDR, SoC), RTL/verification/physical design exposure, data visualization, Linux/Unix familiarity, complex program management experience

Technologies

Python, C/C++, Tcl, Perl, Copilot, Claude, ChatGPT, Linux/Unix, CAD flows