FY27 Intern - Digital Design Engineering Internship - Canada (16 months)
No visa sponsorship
Core
Develop next-generation network connectivity products and high-speed IP for Qualcomm's Data Center roadmap, focusing on AI and high-performance computing.
Role type
Digital Design Engineering Intern
Builds
Connectivity SOCs, SerDes and Ethernet PCS cores
Domain
Semiconductors / Hardware Design
Required skills
RTL design, Verilog, SystemVerilog, FPGA design, EDA tools, C/C++/Python programming
Preferred skills
Silicon tapeout experience, high-speed IP implementation, architecture specification development
Responsibilities
Design and develop industry leading connectivity SOCs, support pre-silicon design verification, support post-silicon validation and lab activities, create reference documents
Seniority
Intern
