CareerPlan

Lead Engineer-Thermal

Hyderabad, Telangāna, IndiaFull-time2026-09-25 → 2026-11-10

Core

Design, analyze, and optimize power and thermal solutions for high-power CPU-based server-class SoCs to ensure reliable power and performance in critical server environments.

Role type

Lead IC thermal and power engineer (hardware/system)

Builds

Server-class System-on-Chip (SoC) power and thermal management solutions

Domain

Semiconductor / Data Center / Cloud Server

Required skills

CPU/GPU/accelerator power management, thermal solution design, heat sink/vapor chamber/cold plate design, thermal throttling management, lab measurement execution, simulation correlation, C/C++/Python programming

Preferred skills

Experience from Intel, AMD, NVIDIA or similar semiconductor companies, data center/cloud server product experience, silicon bring-up experience, collaboration with silicon design and platform teams

Technologies

C, C++, Java, Python, thermocouples, heat sinks, vapor chambers, cold plates, TIMs

Responsibilities

Enable and optimize CPU performance and idle states; define and evaluate thermal limits and cooling solutions; execute power and thermal validation plans (lab measurements, workload testing); correlate simulation vs lab data; collaborate with silicon, platform, BIOS, firmware, and ODM/OEM teams.

Seniority

Senior, hands-on IC