Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Core
Hardware engineering internship supporting CPU, GPU, SoC, Digital Design, and DV tracks to develop next-generation mobile and connectivity solutions.
Role type
Hardware Engineering Intern (multi-disciplinary)
Builds
System architecture, micro-architecture, RTL, synthesis, physical design, and verification environments for mobile SoCs.
Domain
Semiconductor / Mobile Connectivity / AI Computing
Required skills
C, C++, Python, Verilog, SystemVerilog, digital design, RTL development, verification methodology, system-level modeling, power/thermal analysis
Preferred skills
Master's or PhD enrollment, machine learning concepts for DSP/modem, embedded software design, Linux/Windows driver development
Technologies
Vulkan, UVM, Linux, Windows, LTE, 5G, Wi-Fi, Matlab
Responsibilities
Develop test and coverage plans, execute verification plans including regression and debug, model cellular modem datapaths, perform system-level performance modeling and simulation, optimize graphics power and thermal management.
Seniority
Intern
