Staff/Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM
Core
Lead a team to develop and execute reliability test flows for High Bandwidth Memory (HBM) products, driving DPM reduction and root cause analysis for defectivity and intrinsic reliability issues.
Role type
Staff/Principal Engineer, Product Engineering (Reliability)
Builds
HBM DRAM and Interface die products
Domain
Semiconductor manufacturing / Memory technology
Required skills
Reliability test flow development, Root cause analysis (EFA/PFA), Circuit analysis, Statistics and data analysis, Python scripting, Manufacturing test flow optimization, Risk management, Team leadership, Cross-functional collaboration
Preferred skills
Product Engineering experience, Process conversion expertise
Technologies
Python, JMP, EFA, PFA
Responsibilities
Define reliability stress test flows and plans; Execute qualification plans and manage gating issues; Drive extrinsic and intrinsic reliability improvements; Debug and resolve qual/RMA failures via failure analysis; Recommend fab process conversions for yield and cost improvement; Manage risks associated with process conversions; Mentor team members; Make technical decisions on risk and prioritization.
Seniority
Staff/Principal, hands-on IC with team leadership