Mechanical/Thermal Principal Design Engineer
Core
Lead mechanical and thermal architecture for next-generation memory and AI computing platforms, driving design from concept through mass production. (via careerplan.io/jobs/44562077-mechanicalthermal-principal-design-engineer-at-micron)
Role type
Principal Mechanical/Thermal Design Engineer
Builds
Advanced memory modules, storage subsystems, and AI accelerator hardware platforms
Domain
Semiconductor / Memory & Storage / AI Computing
Deliverable
production ML models | product features
Required skills
Thermal management, Mechanical design, CFD simulation, FEA analysis, Heat transfer, Fluid dynamics, GD&T, DFM/DFA, Reliability engineering, Technical leadership
Preferred skills
DDR/LPDDR/PCIe/HBM memory expertise, Data center/server architecture knowledge, AI-enabled engineering workflows, Patent/publication history
Technologies
SolidWorks, ANSYS Icepak, ANSYS Fluent, Heat pipes, Vapor chambers, Liquid cooling systems
Responsibilities
Design and validate mechanical/thermal solutions for electronic systems; Develop cooling technologies (heatsinks, vapor chambers, liquid cooling); Define requirements for performance, quality, and manufacturability; Lead thermal CFD and mechanical FEA analyses; Execute validation strategies (thermal characterization, shock/vibration testing, DFMEA); Drive design reviews and root cause investigations; Mentor engineers and establish domain guidelines.
Seniority
Principal, hands-on IC with strategic influence
