Manufacturing Engineer
Core
Support New Product Introductions (NPIs), production qualifications, and second sourcing programs for semiconductor packages to ensure product time-to-market and business continuity.
Role type
Manufacturing Engineer (Semiconductor Packaging)
Builds
Semiconductor packages and modules for smart home, industrial IoT, and smart cities applications
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Assembly manufacturing experience, Reliability Lab environment experience, material sourcing, BOM management, design review support, equipment maintenance coordination, failure analysis support, process documentation
Preferred skills
Familiarity with Rel equipment, Bond Diagrams, assembly materials, chamber operations
Technologies
Reliability Lab equipment, Bond Diagrams, Chamber equipment
Responsibilities
Support Assembly and Module NPIs and second sourcing programs; Work with Contract Manufacturers (CMs) and OSATs to source new materials; Research and document new Bill of Materials (BOM) with suppliers; Conduct Design Reviews and approve design files from CMs/OSATs; Create Engineering build requests and track qualification lot progress; Support Reliability Lab activities including chamber operations, equipment maintenance, and calibration; Assist in Failure Analysis by coordinating with Device Analysis teams; Develop tracking systems and process flows for failed units.
Seniority
Mid-level, hands-on IC
