Engineer, MTB PCE
Core
Perform material characterization, testing method development, supplier quality investigations, failure analysis, and statistical analysis for semiconductor packaging materials.
Role type
Senior IC materials engineer (semiconductor packaging)
Builds
Material qualification data, testing SOPs, failure analysis reports, and digital quality monitoring solutions
Domain
Semiconductor manufacturing / Materials Science
Required skills
DSC, TGA, DMA, TMA, Rheometer, Contact Angle, Density analysis, Root cause analysis, DOE design, Statistical analysis, Data science tools, Cross-functional collaboration
Preferred skills
AI-driven quality monitoring, Digital transformation initiatives, Supplier management
Technologies
DSC, TGA, DMA, TMA, Rheometer, Contact Angle, Density, Molding compounds, NCF, dicing tapes, liquid EMC, adhesives
Responsibilities
Perform material characterization using analytical techniques; Develop and standardize testing methods and SOPs; Lead supplier material investigations and root cause analysis; Investigate material-related failures and manufacturing defects; Design and execute DOE studies for process optimization; Support AI-driven material quality monitoring and analytics solutions
Seniority
Senior, hands-on IC
