CareerPlan

Advanced CMOS Device & Process Integration Engineer

Hiroshima, JapanFull-time2026-09-24 → 2026-11-10

Core

Establish technical direction for advanced CMOS device and process integration, drive major technology decisions, and lead resolution of complex cross-functional engineering challenges for advanced memory products.

Role type

Principal Advanced CMOS Device & Process Integration Engineer

Builds

Advanced CMOS platforms and future technologies for memory products

Domain

Semiconductor / Memory / CMOS Technology

Deliverable

production ML models

Required skills

CMOS transistor physics, process integration, electrical characterization, variability, reliability, manufacturability, TCAD, compact modeling, DTCO, STCO, AI-assisted engineering strategies, technical roadmap definition, cross-functional leadership

Preferred skills

FinFET/Nanosheet/GAA/CFET architecture expertise, DRAM peripheral CMOS knowledge, patent/publication record, scalable engineering analytics, global research collaboration

Technologies

TCAD, SPICE, AI tools (Claud Assist, Code Assist)

Responsibilities

Define technical strategy and long-term roadmap for advanced CMOS devices; Establish device architecture and process integration targets; Lead resolution of transistor performance, variability, and yield challenges; Guide electrical test structure and model validation strategies; Mentor senior engineers and future subject-matter experts; Establish best practices for engineering rigor and AI-assisted engineering validation

Seniority

Principal, strategy & mentorship