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New College Grad - Wet Etch/CMP/Bond Shift Engineer

Boise, Idaho, United States of America💼 Full-time🗓 2026-08-25 → 2026-10-07

Core

24/7 process development decision-making for next-generation DRAM technologies in Wet Etch/CMP/Bond areas.

Role type

Manufacturing Development Engineering (MDE) Shift Engineer (via careerplan.io/jobs/44144067-new-college-grad-wet-etchcmpbond-shift-engineer-at-micron)

Builds

Next-generation DRAM memory and storage solutions

Domain

Semiconductor manufacturing (DRAM)

Required skills

Semiconductor process control, SPC, DOE, E3 fault detection, data-driven decision-making, engineering troubleshooting, root cause analysis, change control, cross-shift communication

Preferred skills

Area-specific process development (Wet Process/CMP/Bond), Manufacturing Development Engineering experience, process integration knowledge, equipment troubleshooting, AI-enabled engineering solutions

Technologies

SPC systems, E3 systems, DOE tools, Microsoft Office (Excel, PowerPoint, Word), AI-enabled tools

Responsibilities

Serve as primary off-shift engineering decision-maker for development activities; troubleshoot process and equipment issues with cross-functional teams; apply data analysis to investigate excursions and improve yield; maintain accurate documentation and reaction plans; support continuous improvement initiatives and development projects.

Seniority

Entry-level (New College Grad) with Master's degree or Bachelor's + experience