CareerPlan

Intern - Process Development

Boise, Idaho, United States of AmericaInternship2026-08-04 → 2026-10-23

Core

Develop and optimize semiconductor manufacturing processes for next-generation DRAM and HBM memory products.

Role type

Process Development Engineering Intern

Builds

Next-generation memory products (DRAM, HBM)

Domain

Semiconductor manufacturing / Memory technology

Deliverable

production ML models

Required skills

Experimental design, Data analysis, Root-cause analysis, Failure-mode analysis, Statistical methods, AI-enabled analytical tools, Python, MATLAB, JMP, R

Preferred skills

Statistical process control, Model-based problem-solving, Large Language Models (LLMs), Generative AI, Semiconductor manufacturing expertise

Technologies

Python, MATLAB, JMP, R, AI tools, LLMs

Responsibilities

Develop and optimize semiconductor processes, Partner with multi-functional teams, Perform root-cause and failure-mode analysis, Conduct fundamental research, Analyze pilot manufacturing data

Seniority

Intern