Senior Engineer, Unit Process Modeling
Core
Develop physics-based predictive models, Digital Twins, and AI-driven solutions for semiconductor process optimization, yield improvement, and design-space exploration across DRAM, NAND, and advanced packaging.
Role type
Senior IC process modeling engineer (semiconductor)
Builds
Digital Twins, predictive models, and physics-informed AI workflows for fab technology co-optimization
Domain
Semiconductor manufacturing (memory/storage) + Computational Physics + AI/ML
Deliverable
production ML models
Required skills
Physics-based modeling, computational materials science, thermodynamics, plasma/etching modeling, multiphysics simulation, machine learning, deep learning, regression, neural networks, Linux, Bash, Python, FORTRAN, C++, OpenFOAM, ANSYS Fluent, COMSOL
Preferred skills
GenAI, LLM-powered copilots, RAG systems, agentic AI workflows, conference paper publication
Technologies
OpenFOAM, ANSYS Fluent, COMSOL, HPEM, Python, FORTRAN, C++, Bash
Responsibilities
Develop and deploy Digital Twins spanning process, wafer, die, package, and manufacturing domains; Build structural and multiphysics models to evaluate process-structure-performance interactions; Apply advanced computational methods and sparse-data modeling to create robust predictive solutions; Utilize GenAI and agentic AI workflows to integrate engineering tools and manufacturing data; Collaborate across global teams to translate modeling insights into actionable technology decisions.
Seniority
Senior, hands-on IC
