Staff/Principal Engineer - CMP Advanced NAND
Core
Develop and optimize Chemical Mechanical Planarization (CMP) procedures for next-generation 3D NAND memory parts to improve product quality, reliability, and yield.
Role type
Staff/Principal Engineer (CMP Process Development)
Builds
Next-generation 3D NAND memory parts and advanced process monitoring/control methodologies
Domain
Semiconductor manufacturing / 3D NAND / Materials Science
Required skills
CMP process development, 300mm wafer fabrication, dielectrics/metals CMP, optical metrology, profilometry, polishing slurries, conditioners, polishing pads, process integration, vendor collaboration, AI-assisted tool integration, strategic roadmap planning, patent generation
Preferred skills
Data science, modelling, AI workflow optimization
Technologies
AMAT (LKP), EBARA-300X, CMP equipment, optical metrology, profilometry
Responsibilities
Develop and optimize CMP procedures for 3D NAND; manage experiments to widen process margins; collaborate with vendors on integration requirements; design advanced process monitoring and control methodologies; mentor new hires on CMP fundamentals; lead multi-functional projects for quality and yield improvement; provide strategic direction for future NAND nodes.
Seniority
Principal, strategy & mentorship