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MGR, MTTN CMP Process and Equipment

Tainan City, Tainan City, Taiwan💼 Full-time🗓 2026-06-24 → 2026-09-28

Core

Drive CMP module performance in a high-volume semiconductor manufacturing environment, owning both process and equipment performance to achieve yield, defectivity, productivity, and cost targets.

Role type

Senior IC manufacturing engineering leader (CMP process & equipment)

Builds

High-volume semiconductor memory and storage products (DRAM, NAND, NOR)

Domain

Semiconductor manufacturing / Chemical Mechanical Polishing (CMP)

Deliverable

production ML models | product features

Required skills

CMP process optimization, equipment performance management, yield improvement, defectivity reduction, productivity optimization, cost management, AI-enabled engineering decision-making, workflow automation, problem-solving

Preferred skills

AI tool adoption for engineering, high-volume manufacturing experience

Technologies

CMP modules, AI tools for engineering

Responsibilities

Own process and equipment performance, achieve yield and defectivity targets, enhance engineering decision-making with AI, automate workflows, accelerate problem-solving

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