CareerPlan

Principal Engineer - Metals/Implant, Operations Central Teams - Advanced Development Team

Hiroshima, JapanFull-time2026-06-23 → 2026-11-10

Core

Principal Engineer leading early maturity phase transitions of new semiconductor products from technology development to high-volume manufacturing, focusing on yield, quality, and cost improvements.

Role type

Principal Engineer (Semiconductor Operations & Process Development)

Builds

High-volume manufacturing sites for NAND & DRAM memory and storage solutions

Domain

Semiconductor manufacturing (NAND/DRAM), Process Engineering, Hardware

Required skills

Semiconductor process development/optimization, Hardware and supplier management, NAND & DRAM integration, Experimental design, Data analysis, Statistical Process Control (SPC), Solid-state device physics, Process integration, Semiconductor metrology, Defect analysis

Preferred skills

Master's Degree or PhD in Electrical/Mechanical/Materials/Chemical Engineering

Technologies

Semiconductor processing hardware, SPC tools, Process modeling software

Responsibilities

Collaborate with Technology Development on future technology requirements and manufacturing roadmap alignment, Partner with Manufacturing on supplier engagement for strategic objectives, Improve performance and enable customer qualification for new products, Ensure process safety requirements are met with EHSS engineers, Align priorities with strategic suppliers and operations objectives, Develop sophisticated models for unit process and module level control/road mapping, Support module, process and hardware optimization for peers