Principal Engineer/MTS, DRAM PI
Core
Leading process integration activities for next-generation DRAM technology development, focusing on capacitor module design and cross-module integration.
Role type
Principal Engineer, Semiconductor Process Integration
Builds
Next-generation DRAM nodes and high-performance memory/storage products
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process knowledge, Process integration expertise, DOE design and execution, Data analysis, Yield and quality optimization, Cross-functional collaboration
Preferred skills
DRAM device and structure knowledge
Technologies
Semiconductor fabrication tools, DOE methodologies
Responsibilities
Develop and integrate process technologies for future DRAM nodes, Design and optimize capacitor modules, Execute experiments and analyze data to optimize process conditions, Identify and resolve yield and quality issues, Collaborate with process, design, device, and quality teams
Seniority
Principal, hands-on IC with strategic oversight