CareerPlan

Principal Engineer, Films - Procurement and Operations Central Team Advanced Development

Hiroshima, JapanFull-time2026-06-16 → 2026-11-10

Core

Lead semiconductor process development and optimization for NAND & DRAM integration during early maturity phase, transitioning new products from technology development to high-volume manufacturing.

Role type

Principal Engineer, Semiconductor Process & Operations

Builds

High-volume manufacturing sites for NAND & DRAM memory and storage products

Domain

Semiconductor manufacturing (Etch, Films, Planarization)

Required skills

Semiconductor process development, Hardware and supplier management, NAND & DRAM integration, Experimental design, Statistical Process Control (SPC), Solid-state device physics, Semiconductor metrology, Defect analysis, Process hazard analysis, Unit process modeling

Preferred skills

Master's Degree or PhD in Electrical/Mechanical/Materials/Chemical Engineering

Technologies

Etch, Films, Planarization, SPC, Probe and test methodologies

Responsibilities

Collaborate with Technology Development on future technology requirements and manufacturing roadmap alignment; Partner with Manufacturing on supplier engagement for strategic objectives; Improve performance and enable customer qualification for new products; Ensure process safety requirements are met with EHSS engineers; Align priorities with strategic suppliers and operations objectives; Engage with suppliers/consultants for benchmarking data; Develop sophisticated models for unit process and module level control/road mapping; Support module, process, and hardware optimization for peers.

Seniority

Principal, hands-on IC with strategic oversight