SMTS, NAND PI
Core
Lead process modules to design, develop, integrate, and implement solutions improving next-generation 3D NAND product yield, quality, cost, and performance.
Role type
Senior Member of Technical Staff (Process Integration)
Builds
3D NAND semiconductor integrated circuits
Domain
Semiconductor / Non-volatile memory
Required skills
Process integration, Module ownership, Specification definition, Strategic direction, Proactive issue resolution, Performance optimization, Material innovation, Design of experiments, Team leadership, Decision-making, Innovation & IP generation, Technology transfer
Preferred skills
Data analysis, Scripting/programming (Python, SolidWorks, Tableau, Power BI), End-to-end PI module understanding, NAND process flow knowledge, R&D and technology transfer experience
Technologies
Python, SolidWorks, Tableau, Power BI
Responsibilities
Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit; Define structural specifications and process requirements for assigned modules; Set a clear direction and vision for the module and have a well-defined continual improvement plan; Identify potential structure, electrical and reliability issues and address them early with process control; Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization; Analyze materials physically, electrically, etc. and work with process groups to select new material for development; Design and implement device and process experiments to perform process development and process integration; Provide team leadership in module development with assembling and coordinating a development team including process engineers; Make key decisions for the team, as well as provide clear direction, goals and metrics for success of the team; Innovate to address complex problems through both design and process; Coordinate activities such as reticle tapeouts, flow/traveler changes, lot management, etc. across multi-functional teams; Support the transfer of new technology from R&D to high volume manufacturing.
Seniority
Senior, hands-on IC with team leadership