CareerPlan

Principal Design Engineer, DRAM

Boise, Idaho, United States of AmericaFull-time2026-07-08 → 2026-11-10

Core

Design and optimize memory circuits from gate-level to full chip implementations for next-generation DRAM technologies.

Role type

Principal Design Engineer (Semiconductor/DRAM)

Builds

Memory arrays, control logic, address decode, datapath, and internal test logic blocks for DRAM chips.

Domain

Semiconductor / Memory / DRAM

Required skills

Semiconductor circuit design, Layout and optimization, Circuit simulation (SPICE), Hardware description languages (Verilog), Device evaluation and modification

Preferred skills

Memory architecture, CMOS device behavior, Reliability considerations, Silicon validation, AI in circuit design

Technologies

SPICE, Verilog

Responsibilities

Design and optimize memory circuits from gate-level to full chip implementations; Lead development of schematic blocks such as memory arrays, control logic, address decode, datapath, and internal test logic; Perform advanced circuit simulations using industry tools to validate performance; Drive architectural decisions related to power, speed, die area, and overall circuit performance; Collaborate with technology development and business units to define design rules, device requirements, and validation strategies.

Seniority

Principal, hands-on IC with strategic influence