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Principal Node Development Product Engineer, DPAG

Boise, Idaho, United States of America💼 Full-time🗓 2026-05-12 → 2026-09-26

Core

Drive product readiness for next-generation DRAM by bridging process technology, product requirements, and manufacturing execution.

Role type

Principal Node Development Product Engineer (Semiconductor)

Builds

Next-generation DRAM memory and storage solutions

Domain

Semiconductor manufacturing and DRAM technology

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> product features (DRAM nodes)

Required skills

Semiconductor process integration, device physics, silicon data analysis, yield engineering, cross-functional problem solving, lab tools operation

Preferred skills

DRAM process technology scaling, node development, failure mechanism analysis (implants, lithography, etch), technology bring-up qualification, Python scripting

Technologies

Python, lab tools, testers

Responsibilities

Drive process-aware product optimization and identify integration risks; Analyze silicon data to identify systematic process limiters; Partner with design, process, and test teams to debug yield issues; Collaborate with manufacturing to enable node readiness and factory ramp; Translate process changes into product impact assessments; Guide test content and monitoring strategies; Provide technical leadership and mentorship.

Seniority

Principal, hands-on IC with strategic influence

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