Process Integration Engineer
Core
Lead the development, optimization, and sustainment of RegE, bevel, and backside processes to improve yield, quality, reliability, and cost performance in leading-edge DRAM manufacturing.
Role type
Senior IC process integration engineer (semiconductor fab)
Builds
High-volume memory and storage solutions (DRAM)
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models
Required skills
RegE process optimization, bevel process optimization, backside process optimization, yield improvement, defect control, process capability analysis, cross-functional partnership, technology transfer, 300mm fab operations, AI-assisted analytics
Preferred skills
Master's or PhD in Materials/Electrical/Chemical Engineering, technology development, device engineering, module ownership, ramp-up activities, trend sustainment
Technologies
300mm semiconductor manufacturing environment, AI-assisted analytics tools
Responsibilities
Develop and optimize RegE, bevel, and backside process technologies; Lead process improvement initiatives using data-driven methodologies; Monitor and improve process health metrics and defect control strategies; Partner with cross-functional teams to investigate abnormalities and mitigate risks; Support technology development, qualification, and transfer activities
Seniority
Senior, hands-on IC