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Dry Etch Module Technical Staff- MTS/SMTS

Boise, Idaho, United States of AmericaFull-time2026-07-24 → 2026-10-08

Core

Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures to support yield ramp-up.

Role type

Senior IC process engineering leader (Dry Etch) (via careerplan.io/jobs/40100233-dry-etch-module-technical-staff-mtssmts-at-micron)

Builds

Advanced DRAM memory structures

Domain

Semiconductor manufacturing / Memory technology

Required skills

Dry Etch process development, Plasma etch mechanisms, Process control, Defect mitigation, Advanced etch tools (Lam, TEL, AMAT), Cross-functional leadership, Root cause analysis

Preferred skills

High aspect ratio etching, Critical dimension control, Selectivity challenges, Data analytics, DOE methodologies, SPC tools, Sub-20nm integration, Agentic AI workflows

Technologies

Lam, TEL, AMAT

Responsibilities

Lead development and optimization of Dry Etch processes for DRAM; Collaborate with integration, metrology, and equipment teams; Define technical roadmaps for DRAM scaling; Evaluate and implement new etch technologies; Mentor developing engineers; Drive root cause analysis and continuous improvement.

Seniority

Senior, hands-on IC with leadership responsibilities