Senior Member of Technical Staff (SMTS) – Process Development, Dry Etch, NAND
Core
Senior technical leader defining, developing, and transferring advanced dry etch processes for NAND technologies, owning key process levels/modules and translating scaling challenges into executable roadmaps.
Role type
Senior IC process development engineer (dry etch, NAND)
Builds
NAND memory process modules and FOAK (First Of A Kind) dry etch development
Domain
Semiconductor manufacturing, NAND flash memory, Dry Etch
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced dry etch process development, FOAK execution, plasma etch physics/chemistry, DOE/SPC/control strategy, tool robustness mechanisms, multi-functional execution, technical mentorship, data/model-based yield/defectivity resolution
Preferred skills
AI-enabled analysis/automation for process robustness, patent/publication history, industry committee leadership
Technologies
Dry etch tools, plasma etch systems, SPC tools, DOE frameworks
Responsibilities
Own key dry etch process levels/modules and translate technology challenges into executable roadmaps; Lead FOAK dry etch development including recipe architecture and integration alignment; Establish tool robustness mechanisms to improve manufacturability; Drive multi-functional execution across Technology Development, Process Integration, and Manufacturing; Act as recognized technical expert and mentor engineers on plasma etch fundamentals; Contribute to patents and technical knowledge sharing forums
Seniority
Senior, hands-on IC with strategic roadmap ownership